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Architecture Overview

The Project, as illustrated above, defines the application layer that will be deployed on devices and controllers as well as the supported IPv6-based networks to help achieve our interoperability architectural goal.

Project CHIP will initially support Wi-Fi and Thread for core, operational communications and Bluetooth Low Energy (BLE) to simplify device commissioning and setup.

 

CHIP_IP_pyramid.png CHIP Stack Architecture
Matter Architecture Application Layer Details

 

 

Layers Description
Application

High order business logic of a device.

For example, an application that is focused on lighting might contain logic to handle turning on/off the bulb as well its color characteristics.

Data Model

Data primitives that help describe the various functionalities of the devices.

The Application operates on these data structures when there is intent to interact with the device.

Interaction Model

Represents a set of actions that can be performed on the devices to interact with it.

For example, reading or writing attributes on a device would correspond to interactions with the devices.

These actions operate on the structures defined by the data model.

Action Framing

Once an action is constructed using the Interaction Model,

it is framed into a prescriptive packed binary format to enable being well represented on the “wire”.

Security

An encoded action frame is then sent down to the Security Layer

to encrypt and sign the payload to ensure that data is secured and authenticated by both sender and receiver of a packet.

Message Framing & Routing

With an interaction encrypted and signed, the Message Layer constructs the payload format with required and optional header fields;

which specify properties of the message as well some routing information.

IP Framing &

Transport Management

After the final payload has been constructed, it is sent to the underlying transport protocol for IP management of the data.

 

 

 

 

 

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